Method for deposition of fluid and gaseous media on substrates for their transport

ABSTRACT

Substrates, particularly a method of transporting and coating substrates within a confined longitudinal passageway. The method is characterized by the transport and coating of the substrate without human or mechanical contact. The method includes supplying a fluid medium into the confined passageway and discharging the fluid medium from the passageway, such that the moving fluid medium cushions while longitudinally transporting the substrate within the passageway.

The invention relates to a method and apparatus to apply a film of fluidmedium on a surface. Thereby use is made of submicro-filtered gaseousenvironment for this surface during the applying of such a film.

The substrates, processed in that way, can be used in themicroelectronica with the processing of silicon wafers and the like.

In the Dutch patent application No. 8 101 440 of the Applicant anapparatus is disclosed for the applying of fluid medium on a substrate,whereby a guide wall has been used, along which the surface of thesubstrate to be processed is displaceable under direct contact with thewall, before in the process section medium is fed to this substrate.Thereby under vacuum force such substrate is urged against this wall. Byextending the outlets of the media towards near the extension of thisguide wall a micro passage is obtained between the separation walls ofsuch outlets and the substrate, in which passage media can flow alongthis substrate to the discharge channel.

The disadvantages of the apparatus with guide walls for the substratesare the following:

1. During the displacement of the substrate under vacuum force alongsuch wall submicro particles can be removed from this substrate and ascontamination affect the applied coating.

2. Via vacuum channels, positioned in such guide wall, coating or othermedium can be suctioned on and seal off these channels.

3. After passing of the coating supply channel, the substrate can againtake its original shape, and due to deformation thereof the touching ofthe passage wall of the cabin.

4. The suction forces can be too small, with irregularities in width ofthe passage and consequently variations in supply and discharge of themedia.

5. There is no supply possible of high pressurized media to thesubstrate.

6. Variation in thickness of the substrate can cause a damage thereof.

7. After the applying of coating, the coated substrate surface may notbe touched.

With the apparatus and method according to the invention theseshortcomings are eliminated. Thereby the creation and maintaining ofsuch media cushions in the passage aside the substrates, that at leastthe central section of such substrates cannot touch the wall of thesupply- and discharge channels.

The substrates, used in the micro-electronica, have very smallvariations in thickness and have narrow tolerances in unflatness andbow. Consequently, the passage sections aside these substrates can bevery narrow with a corresponding low consumption of media to maintainsuch cushion. The very limited height of the media cushions enables alarge force of process media on the substrates with consequently astrong whirling action in these passage sections of the media. Due tothis whirling action the processing is very intensive and so the lengthof processing is restricted. Also a continuous displacement of thesubstrates is possible during the processing.

The consumption of fluids and gaseous medium per substrate processed islimited and completely allowable in view of the high cost price of suchsubstrates.

Further details regarding the apparatus and method follow from thedescription of the following Figures:

FIG. 1 is an enlarged perspective detail of the cabin, through which bymeans of micro media cushions the substrates are transported withoutcontact with the environment.

FIG. 2 is a vertical cross section of an apparatus, in which the cabinaccording to FIG. 1 is used.

FIG. 3 is a horizontal cross section of the apparatus according to FIG.2.

FIG. 4 is an enlarged detail of the cross section according to FIG. 2 atthe inlet section thereof.

FIG. 5 is an enlarged detail of the cross section according to FIG. 2 atthe discharge section thereof.

FIG. 6 shows a segment package with supply- and discharge channels.

FIG. 7 is a partial cross section of the apparatus according to FIG. 2,in which over two segments supply channels for gaseous medium are shown.

FIG. 8 is a longitudinal cross section of the segment according to FIG.7.

FIG. 9 is an enlarged detail of the segment according to FIG. 8.

FIG. 10 is a cross section of the apparatus according to FIG. 2 withsupply- and discharge channels for various media.

FIG. 10A is an enlarged fragmentary side elevation of the cabin,according to FIG. 2.

FIG. 11 is a side view of a segment, in which discharge channels formedia are located.

FIG. 12 is a cross section over line 12--12 of the segment according toFIG. 11.

FIG. 13 is a side view of a segment, in which channels for fluid mediumare positioned.

FIG. 14 is a cross section over line 14--14 of the segment according toFIG. 13.

FIG. 15 is a detail of the apparatus according to FIG. 2, whereby at oneside the height of the medium cushion is greater than at the other side.

FIG. 16 is a detail of the apparatus according to FIG. 2, whereby asharply bended substrate section is shown.

FIG. 17 is a vertical cross section of an apparatus with on one side asmooth guide wall for substrates to pass through.

FIG. 18 is a vertical longitudinal section of an apparatus, with on oneside both guidewall sections and micro medium cushion sections.

FIG. 19 is a cross section of a modified apparatus, which at one side isprovided with vacuum holders for the substrates, mounted on a turntable.

FIG. 20 is a cross section of a turn table section with a modifiedstructure of the vacuum holder.

FIG. 21 is a cross section of a station for cleaning or rinsing.

FIG. 22 is an enlarged cross section near the substrate of the stationaccording to FIG. 21.

FIG. 23 is an enlarged cross section of the inlet of the dischargechannel of the station according to FIG. 21.

FIG. 24 is a longitudinal cross section of a station for rinsing andfollowing drying of the substrate.

FIG. 25 is an enlarged detail of another embodiment of the station forcleaning of the substrates.

FIG. 26 is an enlarged cross section of the supply- and dischargechannel of the station according to FIG. 25.

FIG. 27 shows the outlet of a supply channel for fluid medium near theend of a substrate.

FIG. 28 shows the outlet of another channel for fluid medium.

FIG. 29 shows a detail of still another station for rinsing.

FIG. 30 is an enlarged cross section of a series channels of a dryer.

FIG. 31 is a cross section of a segment of an oven, in which a heatingelement is located.

FIG. 32 is an enlarged cross section of an oven, in which segmentsaccording to FIG. 31 are located.

FIG. 33 is an enlarged section of a series of channels of a station forthe appliance of fluid for improved adhesion of coating.

FIG. 34 is a modified structure of the station according to FIG. 33.

FIG. 35 is the station according to FIG. 33 with a high vacuum dischargechannel placed in front of it.

FIG. 36 is an enlarged section of an outlet of a supply channel forcoating.

FIG. 37 shows an enlarged section of the channel of FIG. 36.

FIG. 38 is a section of a coating station, in which two thin films ofcoating are successively applied on the substrate with in betweendrying.

FIG. 39 is an enlarged section of a coating station, whereby acombination of thinner and gaseous medium is fed over the applied film.

FIG. 40 shows a series of coating stations with in between drying.

FIG. 41 shows the filling up of a stepped substrate surface with aseries of applied coatings.

FIG. 42 is sectional view of part of the coating station according toFIG. 40 together with a coating and oven station to apply a thin topcoat on the thick under coat.

FIG. 43 schematically shows the appliance of such coatings.

FIG. 44 is a sectional view of a coating station, wherein a gaseousmedium acts as a transport means for thinner in vapor phase.

FIG. 45 is an enlarged sectional view of the inlet of a dischargechannel of the station according to FIG. 44.

FIG. 46 is a longitudinal section of a coating station, wherein a filmof water is fed over the applied coating.

FIG. 47 is an enlarged sectional view of the inlet of the dischargechannel of the station according to FIG. 46.

FIG. 48 is a sectional view of a station for the urging of developingagent over the substrate.

FIG. 49 is an enlarged longitudinal section of the outlet of the supplychannels for the developing agent and the gaseous medium.

FIG. 50 is an enlarged sectional view of the outlet for developer.

FIG. 51 shows the urging of developing agent in different positions ofthe substrate.

FIG. 52 is an enlarged sectional view of a station for urging a dopingagent over the substrate.

FIG. 53 is a sectional view of a modified coping station.

In FIG. 1 part of the apparatus 10 is shown. Thereby by means ofsuccessive segments 12 with in between positioned narrow supply channels14 for media and discharge channels for such media at both sides of thesubstrate 18 micro medium cushions 20 and 22 are maintained. In that wayno mechanical contact can take place between at least sides 24 and 26 ofthe substrates and the interior of the cabin.

In FIGS. 2 and 3 again this apparatus is shown. Thereby the substates 18are transported from the supply station and via take-over station 30 tocabin 32. In this cabin the applying of media on these substrates takeplace, whereby the passing of the following stations: cleaning 34,drying 36, rinsing 38, drying and oven 40, adhesion coat 42, drying 44,first coat 46, drying 48, oven 50, cooling 52, second coat 54, drying56, oven 58, cooling 60, third coat 62, drying 64, oven 66 and cooling68.

There after the substrates are fed into the take-over station 70 andbrought to the discharge station 72.

In the supply station by means of the vacuum block 74 of transporter 76a substrate is taken from cassette 78, transported to take-over station30, brought to guide 82 and by means of transport medium 90 via thenarrow passage 80 in the inlet section 84 is urged into the cabin, seeFIG. 4.

In this section on both sides of passage 80 a number of segments 120 arepositioned, wherein supply channels 86 for transport medium 90 arelocated, see also FIG. 7, and segments 210 with vacuum channels 68, seeFIG. 11.

The processed substrate enters the discharge section 94 of cabin 32,with again on both sides of passage 96 a number of segments 120 and 210and in between series of supply channels 86 for medium 90 and vacuumchannels 88. Thereafter the substrates are fed into the transportsection 98, see FIG. 5.

In view of production speed and consumption of medium it is important,that in cabin 32 successive substrates are close together and contacteach other. Therefore, the combination of forces on the substrates aregreater in the supply section then in discharge section.

Furthermore it is important, that the transport speed of the substratesremains the same. In view of this transport section two guide structures100 and 102 are positioned, of which notches 104, successively beforethe substrates positioned, by means of mechanisms 106 transport thesesubstrates over guide 108 to the take-over section 110.

Thereafter vacuum block 112 of transport mechanisme 114 transport suchsubstrate to a free place 116 of cassette 118.

The inlet- and discharge sections of the cabin function as an air lockpreventing air to enter the cabin. Such in combination with thesubstrates. In FIG. 6 stations are shown for successive processing ofthe substrates, passing through.

In FIG. 7 a cross section is shown of cabin 10, with a side view of twoidentical segments 120, in which channels 122 for gaseous transportmedium are located, see also FIGS. 8 and 9. This agent can preferably benitrogen with fine filtering thereof.

In the upper cabin wall for each segment two supply channels 126 and 128are positioned and whereby segment channels 130 and 132 correspond withthese channels. These channels communicate with a relative wide mainchannel 134, in return communicating with a great number of extremelynarrow branch channels 136. Spread channels 138 connect the branchchannels with common ultra narrow channel 140 and so with the cabinpassage.

Channels 136 have a considerably higher flow resistance for the mediumas passage sections 142 and 144 aside the substrate 18, see FIGS. 15 and16.

In that way each spread channel 138 is supplied with an almost constantflow of medium and such almost independent on the widths of passagesections 142 and 144. Therefore, if during the processing section 142becomes larger than section 144, as is shown in FIGS. 15 and 16, inpassage section 148 a considerably higher pressure will be establishedthan in passage section 146 and ultimately with a minimum width of thissection this pressure will become the high thrust pressure in spreadchannel 134.

In the other, then wide passage section 146. the pressure will drop to avery low value.

In that way a pressure difference of 2 bar or even more is possiblebetween both passage sections 144 and 146 with such large thrusts on thesubstrate 18, that automatically this substrate will be brought to aposition, whereby the force as a result of differences in pressurecorrespond with the local own forces in this substrate.

All media work together to maintain both cushions 20 and 22, whereas thestructure of the segment packages on both sides of the passage is thesame. Thereby on each cm² substrate surface on both sides over 200 mediathrusts can work on such substrate.

In FIG. 16 is shown, how due to increases in temperature a considerablebending of substrate 18 has taken place. An increased flow of warmmedium through wide passage section 146 and a restricted flow of suchmedium through narrow section 144 will result in a larger temperatureincrease at side 150 than at side 152 with consequently a stretching ofthe substrate to a balance position.

To prevent the wearing of the extremely narrow channels in segments 118and 120, these channels are covered with a layer wear resistant material154, see also FIG. 9. The corresponding sections of plate 156 can alsobe provided with such layer, as can also be the case with the ends 158and 160.

Packages 162 and 164 are enclosed positioned in upper cabin section 166and lower cabin section 168, see also FIG. 10. The segments havepolished surfaces with very narrow tolerances in their dimensions.

In the side walls 170 and 172 of these cabin sections channels 178,180,182 and 184 are located, whereas in the other wall sections asidechannels 126 and 128 a channel 136 can be positioned. These channelsextend over a certain length of the cabin and can separately beconnected with supply or discharge piping.

In the cabin walls seal strips 188 are mounted aside these channels. Inthe side walls in grooves 174 circular seal strips 176 are positioned.

In mounted position of the cabin sections 190 and 192 of the segmentsrest against mounting strips 194 and 196. Aside these strips seal strips200 and 202 are positioned, whereas by means of bolts 204 the upper andlower cabin sections are connected with each other.

Within the scope of the invention these strips 194 and 196 can have aconsiderable size and can extend over the whole length of the cabin.

In FIG. 11 segment 210 is shown, in which a roomy vacuum channel 212 islocated, see also FIG. 12. The ends of this channel correspond with thechannels 178 and 182, located in the cabin sections 166 and 168. Thischannel 212 is via a great number of branch channels 214 connected withcommon channel 216. In these channels narrow sections 218 are located toprevent a too easy discharge of medium via such a channel. The flowresistance of such channel is of great importance for the high vacuumchannels 334, see FIG. 35 and 338, see FIG. 38. Thereby in the passagesections between the substrate and the segment areas around such inletof the vacuum channel 214 a high vacuum can be established andmaintained, whereas near other inlets of this group of channels nosubstrate section has to be present. Such is periodically the case withalmost circular substrates.

In FIG. 13 segment 220 is shown, wherein supply of fluid medium takesplace. The main channel 222 is with its end 224 connected with channel180 of the cabin sections 166 and 168. This channel is via a greatnumber of extremely narrow channels 226 connected with seperate spreadchannels 228, which in turn are connected with the extremely narrowcommon channel 230, see also FIG. 14. Thereby a great number of smallwall sections 232 serve to maintain a constant width of this channel230, if an adjacent segment urges against such segment. These channelsmay also be provided with a layer 234 of wear resistant material, as isalso the case with the corresponding sections of the adjacent segment.

Within the scope of the invention other profiles of the channels arepossible and so also the number of channels can be different.

In FIG. 17 cabin 32' is shown, whereby only in the lower part 168'segments are positioned under the creation of various process stations.The upper part 166' of the cabin consists of a guide 236, along whichthe substrates 18 are displaceable.

In FIG. 18 the cabin according to FIG. 17 is shown again, however within the upper section 166' also a number of process stations. As a resulta banding of the substrates or other deformations due to too greatdifferences in temperature are prevented.

In FIG. 19 the upper part of the cabin 23" is a turn table 238, on whicha number of vacuum holders 240 are mounted to suction the substrates 18thereon. In the lower part section 242 is positioned for processing ofsubstrates. By means of one or more setting devices 244 per vacuumholder the distance between the corresponding substrate and the segmentsof the lower cabin part can be changed.

In FIG. 20 vacuum holder 240' urges against the notches 248 of turntable238' and such under the force of spring 246. Thus from sections 242'flowing media urges the substrate upwardly against the force of spring246 with the maintaining of the narrow process passage between thesegments and the substrate.

In FIG. 21 part of the entrance 80 of the cabin and a cleaning station34 is shown. The passage is created by two packages 256, in whichseveral supply channels 86 for gaseous medium 90 and discharge channels88 are positioned. The gaseous medium, flowing through the passagesections 142 and 144, maintain therewith cushions 258 and 260 and alsocontribute to the transport thrust, which is applied on the substrate intransport direction.

Thereupon between successive segments 12 a great number of combinationsof supply channels 262 for whether or not hot fluid cleaning medium 264,supply channels 266 for gaseous medium 268 and in between positioneddischarge channels 270 are located, see also FIGS. 22 and 23.

The under high pressure via channel 262 supplied cleaning agent 262moves through the passage section 272 towards the vacuum channel 270under a hefty whirling and touching of the substrate surface 274, with aremoval of contamination from this surface and transport thereof in theflow.

The via channel 268 supplied gases flow in opposite direction viapassage section 276 to vacuum channel 270 and thereby remove suchcleaning media from the substrate and urge it towards this dischargechannel. After passing of a great number of combinations allcontamination is removed from the substrate.

In FIG. 24 the substrate has entered the drying station 36, whichstation consists of segment packages 286, whereby a number ofcombinations of supply channels 278 for gaseous medium 280 and vacuumchannels 282 are located in these packages. Drying of the substrate 18takes place by means of hot gases 280, streaming through the passagesection 284 along such substrate.

The segment package 286 can also be part of a rinsing section 38,whereby via channels 262 a stream of rinsing fluid 288, as for instancedeionized water, alcohol or thinner is urged.

In FIGS. 25 and 26 another arrangement of channels 262', 266' and 270'for the cleaning station or the rinsing station is shown. Thereby thegases 268 flow via passage section towards discharge channel 270' andwhereby the via supply channel 262' supplied cleaning medium 264 orrinsing medium 288 is urged into the whirling stream of gases.

Within the scope of the invention other arrangements of channels arepossible, as for instance combinations of only supply channels for fluidmedium and discharge channels. Thereby possibly only in the last part ofsuch station the use of supply channels for gaseous medium.

In FIG. 27 the end 292 of substrate 18 has just passed behind theoppositely located discharge channels 262 with the only limited coverageof side wall 294 of this substrate with cleaning or rinsing agent264/288.

In FIG. 28 the end 292 of the substrate has passed the oppositelylocated supply channels 266 for gaseous medium 268 and whereby suchflows of gases debouch into passage 296, wherein a negative pressure ismaintained. Therefrom such gases are suctioned into not occupieddischarge channels.

The cleaning medium 264 and rinsing medium 288 can also be urged towardthe substrate 18, in passage sections 304 and 306 due to heat transferheating of the substrate takes place and thereupon via dischargechannels 308 discharge of these gases occurs. The oven can consist of agreat number of such combinations of channels.

The heating of the substrate occurs very gradually and at the same timeon both sides with minimum differences in temperature. The gases canalready be heated outside the cabin. However it is also possible, thatpart of such heating or all heating takes place in the cabin.

In FIGS. 31 and 32 in segment 310 of insulating material an electricheating element is positioned and whereby on two sides of this segmentsections 314 and 316 are glued. It is also possible, that such anelement is located in a groove of a metal segment.

The heat transfer to the substrate is very effective and very fast,because the volume of the substrate often is very limited. Furthermore,the warm gases hit all left over moisture on the substrate with fastestremoval of it.

Because the increase in temperature of the substrate takes place on twosides with no or allowable deformations of this substrate, the frontsection of the substrate can already have passed this oven, the midsection be located in the oven, whereas the rear end of the substrate isstill in the rinsing section, as is indicated in FIG. 2.

In that way the dimensions of the apparatus 10 in transport directionare very limited and such also because of the limited length of thestations.

The cooling-off station 52, see FIG. 32, consists of the same packagesas shown in station 36 according to FIG. 24 and whereby gases, streamingalong the substrate, provide for a gradual, fast and local cooling off.

In FIG. 33 part of the adhesion promoter station 42 is shown. Viachannel 318 supply of such fluid 320 takes place. This fluid therebyflows in the passage section 328 towards the discharge channel 324. Herealso the removal from the substrate of the excessive fluid by means ofgaseous medium, supplied via channel 326 and urged trough passagesection 328 to vacuum channel 324. Whether or not such section canconsist of a number of such combinations of channels.

In FIG. 34 another arrangement of channels is shown, with successivelysupply channel 318' for the promoter, supply channel 326' for thegaseous medium and the discharge channel 324'. Thereby the width of thepassage section 332 increases in the transport direction.

To effectively apply such fluid on a profiled surface of the substratewithout the inclusion of gas remnants, it is possible to make use of thestation 42", as shown in FIG. 35. Thereby repeatedly before the applyingof fluid 320 via channel 318", by means of high vacuum channel 334 avery high vacuum is drawn in the passage section 336.

The fluid is now able to fill up all steps in the substrate surface andwhereby by means of a channel 326" supplied warm gas 328 the removal ofremovable fluid medium takes place and drying of the film fluid, leftbehind on the substrate can take place.

Thereby it is possible, that such an additional channel 334 is alsopositioned behind channel 326 or 32" to withdraw thinner, which due tothe high vacuum, is brought into vapor phase.

In FIGS. 36, 37 and 38 the first coat station 46 is shown. Thereby thecombination of channels consists successively of: high vacuum channel338, channel 340 for the supply of coating 342, discharge channel 344and channel 346 for supply of whether or not warm gaseous medium 48.Thereupon possibly a high vacuum channel 338.

In passage section 350 a high vacuum is drawn by high vacuum channel338, with consequently in the steps 352 of the substrate there is no oralmost no gaseous medium left behind. The channel 340 supplied coating342 fills these steps without inclusion of another medium, which is ofgreatest importance for an ultimately regular film of coating. Thecoating fills also the total passage section 354 towards the vacuumchannel 344.

Gaseous medium 348, supplied through channel 346, flows in oppositedirection through passage section 356 towards this discharge channelunder stripping off of the excessive coating from the substrate surface358. This stripping off of coating co-operates with the micro-meniscuseffect of the coating 345, which as a column moves along the wallsection 360 of the discharge channel 344 and by means of the vacuum inthis channel is drawn from the substrate and out of the passage section354. Thereby this column of coating exercises a pulling cohesion forceon the thin film of coating, left behind on the substrate.

Dependent on the viscosity of the coating the thickness varies. With avery low viscosity of the coating also in the steps a very thin film ofcoating will be left behind, see FIG. 37^(a).

This coating station 46 is combined shown with the drying-, oven- andcooling-off stations 48, 50 and 52, following thereupon. The number ofcombinations of channels can vary to meet the demands. By using warmgaseous medium, through which in particular a very thin film of coatingis heated very fast, and by applying a high vacuum in the dischargechannels with consequently a lowering of the boiling point of thethinner in the coating, such thinner is evaporated out of the filmcoating very fast. As a result, an extremely fast drying of the coatinglayer occurs.

In the second coating station 54 with identical vacuum-, supply- anddischarge channels the applying of a second coating layer takes place,whereafter again in the successive stations 56, 58 and 60 by means ofgaseous medium drying, hardening and cooling-off of this second coatinglayer takes place.

In FIG. 39 another embodiment 46' of the coating station is shown,whereby through channel 362 a thinner 364 for the coating 342 in vaporphase or mist is urged towards the stream of gaseous medium 348, flowingthrough passage section 356' to the discharge channel 344'. This thinnerhelps to remove a thinned top coat from the coating layer, applied onthe substrate.

In FIG. 40 the successive coating stations 46, 54, 62 and 366 are shownwith repeatedly the following drying-, oven- and cooling-off stations.

It is possible to fill up the steps, located in the substrates, as isshown in FIGS. 41^(A), B, C, D, E.

In FIG. 41^(A) the step 368 is pre-treated and has arrived in avacumized area. In Station 46 the applying of the first coating layer370 has taken place, see FIG. 41^(B), in station 54 the second layer372, see FIG. 41^(C), in station 64 the third layer 374 on top of thesecond layer, see FIG. 41^(D), and in station 366 the fourth layer 376on the third layer, see FIG. 41^(E).

As a result, such a step is completely filled with coating and is analmost smooth surface of the applied coating layer achieved.

In FIG. 42 the apparatus 10 is provided with the additional coatingstation 378, whereby on the fourth layer 376, see FIG. 43^(A), anextremely thin coating layer 380 is applied, see FIG. 43^(B).

With the above described processing it is possible to apply a greatnumber of coating layers on a substrate over a cabin length of 20-40 cm.Thereby the quality of the combined coating layers can be much higher aswith the existing apparatus, because:

1. no contamination in the coating;

2. no extreme escape of air or gases out of the applied coating; and

3. a shorter escape distance for the vaporized thinner during theprocessing.

In FIG. 44 coating station 46" is shown, whereby the thinner as a mistor in vapor phase is brought in the gaseous medium 348. During themoving of this thinner saturated medium over the applied coating, seealso FIG. 45, the top layer of this coating is thinned and can beremoved near the inlet of the discharge channel 344".

In FIG. 46 a coating station 46"' is shown, whereby through channel 382water or other non thinning fluid is urged to the passage section 356"'and this fluid as an extremely thin film 384 covers the already appliedcoating 342. By means of gaseous medium 348 such film is urged towardsthe discharge channel 344"', see also FIG. 47. This film helps to removecoating from the already applied coating layer 386.

Within the scope of the invention still other variations in thearrangement of channels in the coating station are possible.

In FIG. 48 a station 388 is a part of the apparatus. Thereby adeveloping agent 392 is urged towards and over the substrate 18. In thisstations use is made of a number of similar or almost similarcombination of channels. Such a combination consists of a high vacuumchannel 338, supply channel 390 for the developing agent 392, twochannels 394 and 396 for the supply of gaseous medium 398 and dischargechannel 400. At the upper side of the cabin similar combinations arelocated to urge developing- or other agent to the substrate.

The combination of gases and developing agent flows through passagesection along the substrate. Due to the vacumized steps 404 of thesubstrate these steps become totally filled with this agent, whirlingtherein. The under high pressure supplied gases move through passagesection 406 with an accompanying strong whirling action and such inparticular in the steps 404.

By means of a successively repeating of this processing a completeremoval of all removable coating from the substrate is achieved.

In FIG. 50 a detail of the outlet 408 of channel 388 for the developingagent 390 is shown, whereby this agent under very high pressure andspeed is urged toward the substrate. In this outlet a narrow section 410and a widening 412 are located for faster removal of coating from thesteps 404.

Because the passage for the substrates contains no moving element, suchpassage may be filled with the media. In a following station section414, see also FIG. 48, a number of combinations of supply channels forgaseous medium 418 and vacuum channels 420 remove such a cloud of media.

In FIG. 51^(A) such a mist of developing agent 390 and gases 398 inpassge section 422 is shown after passing of the supply channel 390 bythe substrate.

In FIG. 51^(B) is shown, how such a cloud by means of gaseous medium 418is urged towards the high vacuum channel 420.

After the passing of such station the substrate moves through a rinsingstation.

In FIG. 52 the station 424 of the apparatus is shown, wherein dopant asfluid or gaseous medium is urged towards the substrate and such under anextremely high pressure. Through channel 426 the dopant 428 is urgedtowards this substrate, effects the surface of the substrate in passagesection 430 and is removed through discharge channel 432.

Here again a preferred withdrawal of gases through a high vacuum channelbefore the processing. Furthermore, via channel 434 gaseous medium 436is supplied for removal of residue dopant 440 in passage section 438 andsuch in particular from the steps 442.

In the station such combination of channels successively repeats.Furthermore, after channel 434 a high vacuum channel can be positioned.

In FIG. 53 a modification 424' of this station is shown. Thereby in theupper and lower cabin part the repeated combinations of high vacuumchannel 444, channel 426' for supply of dopant 428, four channels 446,448, 450 and 452 for gaseous medium 436 and a high vacuum channel 454.Thereby the dopant with a hefty whirling action is moving through thispassage section.

On one side of the substrate other media can be supplied to thesubstrate.

As dopant for instance arsenicum or phosphor can be used with exactvolumes per second of processing.

A transport system and the processes as above described can be used inconjunction with plasma etching, magnetron sputtering and other complexprocesses.

Furthermore, in the apparatus stations for pattern exposure andmeasurements can be located.

I claim:
 1. Method of transporting and processing substrates within a confined passageway comprising:a. supplying a fluid medium through a supply channel intersecting the passageway, and b. discharging said fluid medium through a discharge channel intersecting said passageway adjacent said supply channel, such that the moving fluid medium cushions, while transporting the substrate in said passageway.
 2. Method of transporting and processing substrates within a confined passageway as in claim 1, including sequential supplying and discharging of said fluid medium on both sides of said substrate via sequentially located supply and discharge channels intersecting the top and bottom of said passageway.
 3. Method of transporting and processing substrates within a confined passageway as in claim 2, including pressurizing said fluid medium, such that both sides of said substrate are transported free of contact with said passageway.
 4. Method of transporting and processing substrates within a confined passageway as in claim 3, wherein sequential supplying and discharging of fluid medium into said passageway is in longitudinal series extending the length of the substrate, such that supplying and discharging is uninterrupted during longitudinal travel of said substrate.
 5. Method of transporting and processing substrates within a confined passageway as in claim 3, including varying said pressurizing of fluid through supply channels on opposed sides of said passageway, such that a micro-height fluid cushion is maintained on one side and a greater-height fluid cushion is maintained on the other side of said substrate.
 6. Method of transporting and processing substrates within a confined passageway as in claim 5, including drawing a vacuum through a channel intersecting said passageway adjacent said supply channel such that said fluid medium is urged longitudinally within said passageway towards and along the surface of said substrate.
 7. Method of transporting and processing substrates within a confined passageway as in claim 6, including simultaneously supplying a gaseous medium through a gaseous supply channel intersecting said passageway adjacent said fluid medium supply channel such that gaseous medium is urged towards and along another substrate while removing fluid medium and gaseous medium through a common discharge channel.
 8. Method of transporting and processing substrates within a confined passageway as in claim 6, including drawing said vacuum through a plurality of adjacent vacuum discharge channels intersecting said passageway, such that a high vacuum is drawn over substantially the entire surface of said substrate.
 9. Method of transporting and processing substrates within a confined passageway as in claim 8, including pressurizing said gaseous medium so as to displace and transport said substrate positioned within said passageway in a transport direction.
 10. Method of transporting and processing substrates within a confined passageway as in claim 9, including cleansing said substrates by distributing cleansing agent through adjacent cleansing agent channels intersecting said passageway so as to direct said cleansing agent over the surface of said substrate.
 11. Method of transporting and processing substrates within a confined passageway as in claim 10, including rinsing said substrate by urging rinsing agent through adjacent rinsing agent channels intersecting said passageway over the surface of said substrate.
 12. Method of transporting and processing substrates within a confined passageway as in claim 11, including distributing an adhesion promotion agent having an extremely low viscosity through a series of adhesion promotion agent channels intersecting said passageway in a longitudinal series along the surface of said substrate in a laterally uninterrupted flow, and further including applying a suction force through adjacent discharge suction channels intersecting said passageway such that an accompanying meniscus effect and gaseous medium of said adhesion promotion agent is removed, while leaving only a very thin layer of adhesion promotion agent on the substrate.
 13. Method of transporting and processing substrates within a confined passageway as in claim 12, including on the side opposed to directing said adhesion promotion agent, distributing a stream of thinning agent for the adhesion promotion agent towards and along the substrate, while drawing a vacuum through adjacent vacuum discharge channels, so as to remove almost entirely gaseous medium and said thinning agent from said substrate.
 14. Method of transporting and processing substrates within a confined passageway as in claim 13, including drawing a high vacuum through a high vacuum discharge channel located forwardly of said substrates and adjacent said adhesion promotion agent supply channel, so as to remove a substantial portion of said gaseous medium from the surface of said substrate.
 15. Method of transporting and processing substrates within a confined passageway as in claim 14, including flowing coating medium through a coating medium channel intersecting said passageway, so that the coating medium is urged towards and along the surface of a substrate in uninterrupted flow, while drawing a suction through an adjacent suction discharge channel so that the accompanying meniscus effect of coating material and gaseous medium portion of said coating material is removed while leaving only a thin layer on the substrate.
 16. Method of transporting and processing substrates within a confined passageway as in claim 15, further including directing a stream of thinning agent for said coating medium via a coating medium supply channel intersecting said passageway and further towards the opposite side of said substrate, including applying a suction through a suction discharge channel so that the thinning agent is urged towards and along the substrate and is removed together with gaseous medium almost entirely from said substrate.
 17. Method of transporting and processing substrates within a confined passageway as in claim 16, including drawing a high vacuum through a high vacuum discharge channel in advance of said substrate in front of said coating medium supply channel, so that almost no gaseous medium is left on the surface of the substrate.
 18. Method of transporting and processing substrates within a confined passageway as in claim 17, including successively advancing said substrate through coating supply channels and drying stations, including a thin layer coating medium supply channel, a drying station, a second coating station and a drying station.
 19. Method of transporting and processing substrates within a confined passageway as in claim 18, wherein the supplying and removing of gaseous media and coatings within said passageway is such that the micro profile surface of the substrate after the last coating is almost flat.
 20. Method of transporting and processing substrates within a confined passageway as in claim 19, including supplying another type of coating through a coating supply channel intersecting said passageway in addition to said first and second coatings.
 21. Method of transporting and processing substrates within a confined passageway as in claim 20, including supplying a vaporized thinner in particle array towards and along the substrate surface via thinner supply channels intersecting said passageway, such that said thinner condenses on the applied layer of coating and in that way thinning said applied coating and by advancing said gaseous medium a film of said thinner is urged over said layer of coating towards a combined discharge channel intersecting said passageway.
 22. Method of transporting and processing substrates within a confined passageway as in claim 21, including applying hot gaseous medium towards and along the surface of said substrates by hot gaseous medium supply channels and hot gaseous medium discharge channels intersecting both sides of said passageway.
 23. Method of transporting and processing substrates within a confined passageway as in claim 22, including urging developing agent under extremely high pressure towards said substrates via adjacent developing agent supply and discharge channels intersecting said passageway. 